San Jose, CA. - November 18, 2002 -- Olympus Integrated Technologies America, Inc. (Olympus-ITA) of San Jose has entered into an application development agreement with International SEMATECH (ISMT) to characterize and refine the use of Deep UV imaging for defect review and process control in the fab. The Olympus FR3200 ADC Deep UV inspection and review station has recently been installed at ISMT’s Austin site.

According to Dale Sheu, ISMT Project Manager, "The industry is seeking quick, high resolution imaging for defect and process characterization. Our challenge is to extend optical defect review and wafer inspection, so that we can resolve defects and features that we previously couldn’t see without a SEM based tool."

With its improved resolution and contract, the Deep UV optics technology utilized in the FR3200 allows for identification of defects using optics similar to those in patterned wafer inspection tools. The FR3200 ADC’s onboard automatic defect classification (ADC) technology combined with its Deep UV imaging will also play a critical role in accelerating the fab’s yield management program for baseline defectivity assessment.

Rick La France, President of Olympus-ITA is pleased to have the opportunity to place this system at the ISMT facility. "We recognize the value to the member companies of extending optical wafer inspection by utilizing deep UV. We also welcome the support of ISMT in the further characterization and applications development of Deep UV imaging technology as well as Automatic Defect Classification."

About Olympus-Integrated Technologies America
Olympus Integrated Technologies America, Inc. of San Jose provides product and direct sales/service support for Olympus optical inspection and defect review products and OEM Optics in the U.S. market. Olympus-ITA is an emerging semiconductor equipment supplier with the backing of Olympus Corporation, Japan, an eighty- year old, $4 billion dollar organization.