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Olympus-ITA's AL3100 Performs Inspection & Defect Review on 200 and 300mm Wafers

San Jose CA - February 15, 2005 -- The Model AL3100 System from Olympus Integrated Technologies America (ITA) delivers inspection and defect review capabilities for both 200 and 300 millimeter wafers in a single small footprint. The system performs a broad range of inspection and defect review tasks, tracking defects, and maximizing yields for manufacturers on the leading edge of semiconductor processes.

The Olympus Universal Infinity Systems (UIS) optics package integrates Olympus' 248 nanometer patented Deep-UV Air Gap design objective with a variety of visible light imaging methods to increase the resolution limit of optical inspection to 0.08 micron. Multiple wafer robotic handling, precision high-speed x-y wafer staging, and laser auto focus allow the operators to inspect and review wafers as quickly as they can make a decision. User friendly, intuitive software provides easy programming of defect review and inspection functions on either 200mm or 300mm wafers in a single system with minimal footprint. Flexible load port configuration enables the system to adapt to any manufacturing area layout requirement.

The AL3100 allows both front and back side macro and micro inspection in a single pass. Macro inspection is easily programmed for various positions, rotation speeds, and illumination wavelengths. The operator can use a joystick to control wafer tilt for optimum observation. Micro inspection allows the operator to view the wafer under a range of magnifications using techniques that include bright field, dark field, DIC, confocal, and high resolution DUV and DUV confocal. Additional features include image acquisition and storage, edge inspection, defect logging, and defect classification.

Defect data can be imported from a variety of inspection or yield management systems. The defects are rapidly relocated and can be quickly imaged and classified. The optional high resolution DUV optics provides the valuable extra resolution needed to observe, identify, and eliminate smaller and smaller defects. Defect data and images can be stored or transferred to the user's yield management system or database.

A variety of SEMI compliant load ports (FOUP, FOSB, SMIF, open cassette) can be attached to the system in various configurations (front, rear or side load) to allow the system to meet any manufacturing floor layout requirement. The station is available with GEM300 factory automation software for seamless integration into the user's automated factory.

About Olympus-Integrated Technologies America
Olympus Integrated Technologies, Inc. (ITA) was founded in March 2000 as a wholly owned subsidiary of Olympus Corporation, Tokyo, Japan. Specializing in semiconductor products and systems for wafer inspection and defect review, ITA is the application software development R&D center for Olympus semiconductor products. Its location in San Jose, California, enables the company to respond quickly to provide sales, service, and support to semiconductor companies throughout the United States. For more information contact Greg Baker at 408-514-3918, email gbaker@olympus-ita.com, or visit our website at www.olympus-ita.com.

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For further information, please contact:
Olympus Integrated Technologies America, Inc.
Greg Baker, Chief Operating Officer
180 Baytech Drive
San Jose, CA 95134
Phone: 408-514-3918
Fax: 408-946-3841
E-mail: gbaker@olympus-ita.com
       A·R Marketing, Inc.
Andrea Roberts
PO Box 501528
San Diego, CA 92150
Phone: 858-451-8666
E-mail: aroberts@san.rr.com



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