home contact us Olympus Global Site

Press
Release
Archive



Olympus Integrated Technologies America Receives Attendees' Choice Award at SEMICON West for its FR3200 BB-DUV Defect Review System
Voted Best Solution to a Problem

Photo of available at http://www.olympus-ita.com/images/SEMICON_West_Award_2007.jpg

San Jose CA - August 17, 2007 -- Olympus Integrated Technologies America (Olympus-ITA), a subsidiary of Olympus Corporation of Japan and a leader in quality inspection and defect review systems, was named by Solid State Technology and Advanced Packaging as a winner of the fifth annual Attendees Choice Awards competition at SEMICON West 2007. The Award was presented to Olympus-ITA for its FR3200 BB-DUV Defect Review System as the "Best Solution to a Problem".

The Attendees' Choice Award spotlights technologies presented at SEMICON West. Show attendees vote for the product they deem best in terms of innovation, cost-of-ownership, and best solution to a problem. SEMICON West, held in San Francisco, CA from July 17-19, 2007, is the preeminent trade show in the semiconductor industry with over 20,000 visitors and 1,250 exhibiting companies. It is sponsored by SEMI, the semiconductor industry trade association.

"The North American semiconductor market has increased in importance globally," said Olympus Semiconductor Chairman and CEO, Akimasa Wakabayashi. "Since joining Olympus, Greg has been instrumental in establishing a roadmap and in developing the software and the products for Olympus' semiconductor inspection and defect review equipment. Sales of Olympus-ITA division have grown considerably under his direction. We are pleased he has accepted the position of Olympus-ITA president."

The FR3200 200 and 300mm Wafer Inspection and Automated Defect Review System integrates a new Broadband DUV technology for higher resolution and better material contrast and characterization on advanced films and materials. The multiple band DUV optics provide imaging in single or combined UV and DUV bands in addition to the broad range of visible light imaging methods. With the advent of many new materials in front-end processing, this flexible multi-band DUV observation method is powerful in characterization of advanced material defects. The FR3200 also includes macro observation under various selectable wavelength illuminations.

Solid State Technology magazine, with a circulation of over 41,000, is the longest-running and most complete source of information for engineers, operators, managers, tool and materials suppliers, and semiconductor researchers. Advanced Packaging magazine, with a circulation of over 22,000, serves businesses that integrate electronic component packages into circuitry of their end products. Both magazines are published by PennWell Corporation.

About Olympus-Integrated Technologies America
Olympus Integrated Technologies, Inc. (ITA) was founded in March 2000 as a wholly owned subsidiary of Olympus Corporation, Tokyo, Japan. Specializing in semiconductor products and systems for wafer inspection and defect review, ITA is the application software development R&D center for Olympus semiconductor products. Its location in San Jose, California, enables the company to respond quickly to provide sales, service, and support to semiconductor companies throughout the United States. For more information contact Greg Baker at 408-514-3918, email gbaker@olympus-ita.com, or visit our website at www.olympus-ita.com.

# # #


For further information, please contact:
Olympus Integrated Technologies America, Inc.
Greg Baker, President
180 Baytech Drive
San Jose, CA 95134
Phone: 408-514-3918
Fax: 408-946-3841
E-mail: gbaker@olympus-ita.com
       A·R Marketing, Inc.
Andrea Roberts
PO Box 501528
San Diego, CA 92150
Phone: 858-451-8666
E-mail: aroberts@san.rr.com



Copyright 2006-2008 Olympus Integrated Technologies America, Inc.
Olympus Integrated Technologies America (ITA) is a division of the Global Olympus Group
Privacy Policy | Terms of Use